Description
Memory Corruption in Core during syscall for Sectools Fuse comparison feature.
Affected products
| Vendor | Product | Affected | Fixed |
|---|---|---|---|
| Qualcomm | Snapdragon | FastConnect 6700, FastConnect 6900, QCA6391, QCM6490, QCS6490, QSM8350, Qualcomm Video Collaboration VC3 Platform, SD888, SM7315, SM7325P, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325… | — |
Advisories 2
- WID-SEC-2023-3056 Samsung Android: Mehrere Schwachstellen BSI CERT-Bund (WID) · Dec 4, 2023
- WID-SEC-2023-2842 Google Android: Mehrere Schwachstellen BSI CERT-Bund (WID) · Nov 6, 2023