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OpenAdvisories
High · 7.8 CVE-2026-21372 EUVD-2026-19323GHSA-73jc-v74h-5w6r

Heap-Based Buffer Overflow in Power Management IC

Published Apr 6, 2026 · Updated Apr 7, 2026 · Assigned by qualcomm

Description

Memory Corruption when sending IOCTL requests with invalid buffer sizes during memcpy operations.

Affected products

VendorProductAffectedFixed
Qualcomm Snapdragon Cologne, FastConnect 6700, FastConnect 6900, FastConnect 7800, QCM5430, QCM6490, Qualcomm Video Collaboration VC3 Platform, Snapdragon 460 Mobile Platform, Snapdragon 662 Mobile Platform, Snapdragon 7c+ Gen 3 Compute, WCD9370, WCD9375, WCD9378C, WCD9380, WCD9385, WCN3950, WCN3988, WSA8840, WSA8845,… —

Advisories 2

References